RAW CARD COMPONENT ASSEMBLY
Assemble boards from your parts kits. Fast delivery and low cost, SMT and Thru-hole.

PRINTED CIRCUIT BOARD DESIGN/LAYOUT
Design tools for the fastest turnaround of SMT and Thru-hole designs, up to 24 layers utilizing ORCAD and CADNETIX with output to other CAD programs. High-speed tools plus an experienced staff allows us to design for manufacturability at very competitive pricing.

RAW CARD MANUFACTURING
Quick-turn prototypes to production. Single sided, Double sided or Multi-layer. High technology board experts. Call now for the best price and delivery.

CUSTOM CAM ENGINEERING
Step and Repeat circuits - Merge Layers. Design Rule Checking (DRC) of your Gerber data. Generate Excellon drill data from photoplotting file. Multi-layer Panelization.

PCB Assembly Service

LPS’ capabilities as a contract manufacturer includes volume capacity for thru-hole and high level SMT including mixed technology and high density, fine pitch, double sided SMT.

DUAL WAVE SOLDER
Dual wave feature allows for simultaneous soldering of back side SMT components and front side thru hole components. Chip wave and laminar wave can be separately adjusted for optimal soldering

• 48" bottom heater adjustable to within 1" of actual process width.
• 36" top side heater with separate temperature controls.
• 18" conveyor width.
• Edge finger conveyor.
• Presentation of PCB to solder wave is repeatable to a max. deviation of 0.003".
• Motor driven conveyor height adjustable tolerance +/- 0.001".

FORCED CONVECTION REFLOW
Forced convection assures uniform temperature from leading to trailing edge and board to board, regardless of component density or board loading. Forced convection eliminates the problems of component body shadowing seen with previous IR technology.

• 18" conveyor width.
• Edge finger and mesh belt conveyor systems.
• 8 separately controlled heating zones.
• Closed-loop PID controller interfaced through a high-speed PC.
• Computer controlled graphical 3 thermocouple board profiling system.

AUTOMATED SMT PLACEMENT WITH ON THE FLY VISION CENTERING
100% vision centering has proven to be the only method capable of handling the full complement of surface mount devices available to the industry.

• 26" x 19" placement area.
• 80 separate component feeder capacity.
• Feeder types: 8, 12, 16, 24, 32, 44mm tape; vibratory stick; matrix tray.
• Feeders contain memory devices to store part info, minimizing production errors.
• Component size range: 0402 to 2" x 2" (51mm)
• Minimum lead pitch is 15mil.
• Placement Accuracy is +/- 0.0025".
• Maximum placement rate is 6500 components per hour.
• Head configuration: Two independent placement heads with 2 spindles per head.
• Touch screen computer controlled.
• Programming: Self-teach with downward viewing camera or direct CAD download.
• Off-line computer programming capability for generating placement files.

THRU-HOLE PREP AND INSERTION
Axial and Radial automated prep and insertion machines are utilized to achieve maximum performance, yield and lead insertion. Thirty six feet of slide line are used for manual insertion purposes when needed. All areas and personnel are grounded against static discharge.

REWORK CAPABILITIES
Gold brush plating, burnishing, thru-hole, SMT, and BGA component removal and replacement.

CLEANING
No-clean fluxes and pastes are utilized through the assembly process. This enables us to operate without CFC's and maintain high surface insulation resistance without cleaning. There are no residues to interfere with the ATE probes and the process is non corrosive and actually safer than RMA fluxes. State of the art cleaning systems including high pressure chemical soaponifier spray and immersion ultrasonic are also utilized.

QUALITY
Complete process and product specifications are available upon request. We currently build to ANSI/ IPC-A-610 Class III specifications.